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Printed Circuit Board Assembly
- IPC J-STD-001F, IPC-A-610F Class II & III
- Materials IQC ( C = 0 Sampling Plan )
- SnPb and RoHS Soldering
- Extra Large Board (630x570mm)
- Micro BGA, CSP (0.5mm), 0402 chips
- AOI and Digital Microscope
- High Melting Point(HMP) soldering process
- TCP ACF Bonding
- In-Circuit Test Fixture & Software Development
- Functional Tester Development
- 2D/3D Barcode Development
- Environment and ESS Testing
- DFM, DFT and CAD Support
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