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  • IPC J-STD-001F, IPC-A-610F Class II & III
  • Materials IQC ( C = 0 Sampling Plan )
  • SnPb and RoHS Soldering
  • Extra Large Board (630x570mm)
  • Micro BGA, CSP (0.5mm), 0402 chips
  • AOI and Digital Microscope
  • High Melting Point(HMP) soldering process
  • TCP ACF Bonding
  • In-Circuit Test Fixture & Software Development
  • Functional Tester Development
  • 2D/3D Barcode Development
  • Environment and ESS Testing
  • DFM, DFT and CAD Support
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